Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade. A dicing saw is equipped with the machine which cuts these wafers into individual chips. Materials that are sliced from these machine are silicon, silicon carbide, gallium nitride, gallium arsenide, and ceramic, among others. These wafers are used for production of semiconductors, which in turn, are used in the manufacturing of electronic components.
Shortcomings of conventional slicing machine is one of the major factors driving growth of the market
One of the major factors attributed to growth of the market is restraints in using conventional slicing machines including high volume of wastage while cutting the wafer, low speed of slicing the wafer, and low quality of dices. These factors are driving manufacturers to develop advanced wafer slicing machines, to overcome the challenges associated with conventional machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing machine. This machine ensures maximum material utilization while cutting and it requires low electricity while production and this machine also not produces any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges associated with the recycling of silicon wafer.
Additionally, miniaturization of electronic devices is further propelling demand for small size chips to be incorporated in electronic devices, which in turn is driving demand for diamond wire wafer slicing machines, globally. This is due to higher accuracy of these machines to cut a wafer into smaller sizes as compared to conventional slicer machines. For instance, according to a press release of Apple, Inc., in May 2018, the company announced that it is going to use a 7nm (nanometer) chip for next generation iPhone and the processor will be named as ‘A12’ chip. This chip will be much smaller, faster, and more efficient than 10-nanometer chips, which is being used in current Apple devices such as iPhone 8 and iPhone X. Hence, all these factor will help in propelling growth of the market.
Global Diamond Wire Wafer Slicing Machine Market: Key Trends
Increasing use of large size of wafer is a key trend that is being witnessed in the market. For instance, according to a press release of SEMI, a leading semiconductor manufacturing company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases, it will further increase the number of dies cut from it, which in turn helps in reduction of production cost as well as product wastage while slicing process. Therefore, as the size of wafer increase, it need more efficient machine to provide accurate cuts, and produce more dies from a single wafer.
High cost of machine is one of the major factor restraining growth of the market
High cost of diamond wire wafer slicing machines is a major restraining factor for growth of the market. For instance, according to Coherent Market Insights’ analysis, the cost of 40HP Diamond Wire Machine is US$ 5088.75 per unit and cost of the 60HP Diamond Wire Machine is US$ 6563.75 per unit. Moreover, maintenance cost of these machines is also very high, which is another factor hampering growth of the market.
Global Diamond Wire Wafer Slicing Machine Market: Regional Insights
The market for diamond wire wafer slicing machine in Asia Pacific accounted for largest share in the global market in 2017. The factor attributed to growth of the market is increasing penetration of smartphones, increasing adoption of IoT, self-driving cars, and others. Therefore, rising demand for consumer electronics is leading to high demand for diamond wire wafer slicing machines. For instance, according to the Coherent Market Insights’ analysis, the number of smartphone users in India was 292.6 million in 2016 and it has grown to 342 million in 2017. Increasing demand for smartphones and advancement in smartphone technology has led to development of thinner and smaller ICs. This leads to high demand for diamond wire wafer slicing machine. Hence, this factor will help in propelling growth of the market during the forecasted period.
Moreover, presence of key manufacturers such as Samsung, Sony, LG, Toshiba, Panasonic, Toyota, and Honda makes this region largest consumer of semiconductor ICs, which is another major driving factor leading to high demand for diamond wire wafer slicing machine for cutting wafer. Hence, this factor also helps in fuelling growth of the diamond wire wafer slicing machine in this particular region.
Global Diamond Wire Wafer Slicing Machine Market: Competitive Landscape
Major players operating in the global diamond wire wafer slicing machine market are Dalian Linton NC Machine Co., Ltd, Meyer Burger Technology AG, Slicing Tech,, Diamond Wire Technology, Disco Corporation, Plasma Therm LLC, Tokyo Electron Ltd, ATV Technologies, and EV Group among others.
Key players in the market are focusing on adopting product development strategy, in order to gain competitive edge in the market. For instance, in September 2014, Dalian Linton NC machine co., LTD. launched its new product QPJ1660B diamond wire wafer slicing machine. The production by using this system is clean as it based on water cutting fluid technology, which reduces environmental pollution caused by waste fluid.